Silicide characterization at alumina–niobium interfaces

Alumina–niobium interfaces formed by liquid-film-assisted joining with copper/niobium/copper interlayers exhibited microstructures that depend on the nature of the alumina components. Characterization of these interfaces in the transmission electron microscope provided insight on the relationship be...

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Veröffentlicht in:Journal of materials science 2011-06, Vol.46 (11), p.3969-3981
Hauptverfasser: McKeown, J. T., Radmilovic, V. R., Gronsky, R., Glaeser, A. M.
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Sprache:eng
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Zusammenfassung:Alumina–niobium interfaces formed by liquid-film-assisted joining with copper/niobium/copper interlayers exhibited microstructures that depend on the nature of the alumina components. Characterization of these interfaces in the transmission electron microscope provided insight on the relationship between interfacial microstructure and fracture performance. Interfaces between sapphire and niobium and those between high-purity (99.9%) polycrystalline alumina and niobium were free of secondary phases. However, niobium silicides were found at interfaces between lower-purity (99.5%) alumina and niobium, identified by electron diffraction analysis as the body-centered tetragonal α-Nb 5 Si 3 phase. Spatially resolved compositional analysis was conducted on silicide particles at and away from the interface.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-011-5324-z