Miocene Smilax leaves and associated epiphyllous fungi from Zhejiang, East China and their paleoecological implications
Smilax tiantaiensis sp. nov. is described from the Late Miocene Shenxian Formation in Zhejiang Province, East China based on five fossil leaves with fine venation and well preserved cuticles. The fossil leaves are characterized by an ovate shape, entire margin, mucronate apex, rounded base, five pri...
Gespeichert in:
Veröffentlicht in: | Review of palaeobotany and palynology 2011-06, Vol.165 (3), p.209-223 |
---|---|
Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Smilax tiantaiensis sp. nov. is described from the Late Miocene Shenxian Formation in Zhejiang Province, East China based on five fossil leaves with fine venation and well preserved cuticles. The fossil leaves are characterized by an ovate shape, entire margin, mucronate apex, rounded base, five primary basal acrodromous veins with reticulate venation in between; leaves hypostomatic, anticlinal walls undulated and stomatal apparatus anomocytic. The fossils have been compared with extant and other fossil species hitherto described in this genus. Some fossil stromata, hyphae and spores identified as
Callimothallus pertusus Dilcher (Microthyriaceae) were discovered on the both epidermides of
S. tiantaiensis. The climbing habit of
Smilax and the presence of the epiphyllous fungus of
C. pertusus on the fossil leaves may indicate that the multistratified forest was growing under a humid climate during the Miocene in Zhejiang.
► Leaf architectures and cuticle structures of Miocene
Smilax leaves were investigated. ► Cuticle characters are helpful to fossil identifications. ► Fossil
Smilax existed in the forest demonstrates a multilayered structure. ► Living habits and associated epiphyllous fungi indicate a warm and humid climate. |
---|---|
ISSN: | 0034-6667 1879-0615 |
DOI: | 10.1016/j.revpalbo.2011.03.004 |