Effect of pH on surface energy of glass and Teflon and theoretical prediction of Staphylococcus aureus adhesion

The surface energy of glass and Teflon at various pH values was examined. Contact angle was used to determine physico-chemical substratum properties. The surface energy of both substratums including, hydrophobicity, and electron donor/electron acceptor (Lewis acid–base properties) were found to depe...

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Veröffentlicht in:Materials Science & Engineering C 2009-05, Vol.29 (4), p.1302-1305
Hauptverfasser: Hamadi, F., Latrache, H., Zekraoui, M., Ellouali, M., Bengourram, J.
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Sprache:eng
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Zusammenfassung:The surface energy of glass and Teflon at various pH values was examined. Contact angle was used to determine physico-chemical substratum properties. The surface energy of both substratums including, hydrophobicity, and electron donor/electron acceptor (Lewis acid–base properties) were found to depend on pH of contact solution. The maximum of hydrophobicity (higher negative value of Δ G iwi) was obtained at pH 11 and pH 6.5 for glass and Teflon respectively. The electron donor property was higher at pH 5 and pH 3 for glass and Teflon respectively. Moreover, prediction of Staphylococcus aureus adhesion on both substratums was estimated by calculating the total interaction free energy (Δ G Tot). Based on the value of Δ G Tot, S. aureus should adhere to glass at pH 2, pH 3 and pH 11 with the maximal adhesion obtained at pH 3 and pH 11. For Teflon, regardless of pH values, S. aureus should be able to attach on this substratum with the high adhesion level at pH 5. The relation between surface energy of substratum and the total interaction free energy was also examined. Based on this relation and the value of the components of total interaction free energy, we show that adhesion to glass could be governed by both short range forces (Lewis acid–bases forces) and by long range forces (van der Waals forces) and the adhesion to Teflon could be mediated only by the short range forces.
ISSN:0928-4931
1873-0191
DOI:10.1016/j.msec.2008.10.023