Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections
An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatc...
Gespeichert in:
| Veröffentlicht in: | IEEE photonics technology letters 2003-11, Vol.15 (11), p.1567-1569 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1569 |
|---|---|
| container_issue | 11 |
| container_start_page | 1567 |
| container_title | IEEE photonics technology letters |
| container_volume | 15 |
| creator | Bakir, M.S. Gaylord, T.K. Martin, K.P. Meindl, J.D. |
| description | An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10 5 /cm 2 . The compliance of the polymer pillars is shown to be 3-5 μm/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated. |
| doi_str_mv | 10.1109/LPT.2003.818651 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_miscellaneous_901666873</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>1237590</ieee_id><sourcerecordid>901666873</sourcerecordid><originalsourceid>FETCH-LOGICAL-c390t-24e079ef9389c003a52a530e177920b57eb1b53e97a73562d99c45195b5078aa3</originalsourceid><addsrcrecordid>eNp9kc1LAzEUxBdRsFbPHrwED3raNh-bTeJNih-FQgXrxUtI41tMSTdrslX635tSQfDgaebwm8c8pijOCR4RgtV49rQYUYzZSBJZc3JQDIiqSImJqA6zx9kTwvhxcZLSCmNScVYNitdnMCg0qAt-u4aIOue9iekG2bDuvDNtj75MA7H08AkegQfbR2eNL0PX7xTZd9eh6XiOXNtDtKFtM-JCm06Lo8b4BGc_Oixe7u8Wk8dyNn-YTm5npWUK9yWtAAsFjWJS2dzfcGo4w0CEUBQvuYAlWXIGShjBeE3flLIVJ4ovORbSGDYsrvd3uxg-NpB6vXbJQv6jhbBJWmFS17UULJNX_5JUcqGkohm8_AOuwia2-QstZUVzU1VnaLyHbAwpRWh0F93axK0mWO8m0XkSvZtE7yfJiYt9wgHAL02Z4Aqzb8CPhhE</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>884238996</pqid></control><display><type>article</type><title>Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections</title><source>IEEE Electronic Library (IEL)</source><creator>Bakir, M.S. ; Gaylord, T.K. ; Martin, K.P. ; Meindl, J.D.</creator><creatorcontrib>Bakir, M.S. ; Gaylord, T.K. ; Martin, K.P. ; Meindl, J.D.</creatorcontrib><description>An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10 5 /cm 2 . The compliance of the polymer pillars is shown to be 3-5 μm/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated.</description><identifier>ISSN: 1041-1135</identifier><identifier>EISSN: 1941-0174</identifier><identifier>DOI: 10.1109/LPT.2003.818651</identifier><identifier>CODEN: IPTLEL</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Chips ; Density ; Diffraction gratings ; Electron optics ; Gratings (spectra) ; Interconnections ; Joining ; Optical coupling ; Optical interconnections ; Optical polymers ; Optical refraction ; Optical surface waves ; Optical waveguides ; Pillars ; Scanning electron microscopy ; Sockets ; Surface waves</subject><ispartof>IEEE photonics technology letters, 2003-11, Vol.15 (11), p.1567-1569</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2003</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c390t-24e079ef9389c003a52a530e177920b57eb1b53e97a73562d99c45195b5078aa3</citedby><cites>FETCH-LOGICAL-c390t-24e079ef9389c003a52a530e177920b57eb1b53e97a73562d99c45195b5078aa3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/1237590$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27903,27904,54736</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/1237590$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Bakir, M.S.</creatorcontrib><creatorcontrib>Gaylord, T.K.</creatorcontrib><creatorcontrib>Martin, K.P.</creatorcontrib><creatorcontrib>Meindl, J.D.</creatorcontrib><title>Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections</title><title>IEEE photonics technology letters</title><addtitle>LPT</addtitle><description>An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10 5 /cm 2 . The compliance of the polymer pillars is shown to be 3-5 μm/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated.</description><subject>Chips</subject><subject>Density</subject><subject>Diffraction gratings</subject><subject>Electron optics</subject><subject>Gratings (spectra)</subject><subject>Interconnections</subject><subject>Joining</subject><subject>Optical coupling</subject><subject>Optical interconnections</subject><subject>Optical polymers</subject><subject>Optical refraction</subject><subject>Optical surface waves</subject><subject>Optical waveguides</subject><subject>Pillars</subject><subject>Scanning electron microscopy</subject><subject>Sockets</subject><subject>Surface waves</subject><issn>1041-1135</issn><issn>1941-0174</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2003</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kc1LAzEUxBdRsFbPHrwED3raNh-bTeJNih-FQgXrxUtI41tMSTdrslX635tSQfDgaebwm8c8pijOCR4RgtV49rQYUYzZSBJZc3JQDIiqSImJqA6zx9kTwvhxcZLSCmNScVYNitdnMCg0qAt-u4aIOue9iekG2bDuvDNtj75MA7H08AkegQfbR2eNL0PX7xTZd9eh6XiOXNtDtKFtM-JCm06Lo8b4BGc_Oixe7u8Wk8dyNn-YTm5npWUK9yWtAAsFjWJS2dzfcGo4w0CEUBQvuYAlWXIGShjBeE3flLIVJ4ovORbSGDYsrvd3uxg-NpB6vXbJQv6jhbBJWmFS17UULJNX_5JUcqGkohm8_AOuwia2-QstZUVzU1VnaLyHbAwpRWh0F93axK0mWO8m0XkSvZtE7yfJiYt9wgHAL02Z4Aqzb8CPhhE</recordid><startdate>20031101</startdate><enddate>20031101</enddate><creator>Bakir, M.S.</creator><creator>Gaylord, T.K.</creator><creator>Martin, K.P.</creator><creator>Meindl, J.D.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20031101</creationdate><title>Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections</title><author>Bakir, M.S. ; Gaylord, T.K. ; Martin, K.P. ; Meindl, J.D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c390t-24e079ef9389c003a52a530e177920b57eb1b53e97a73562d99c45195b5078aa3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2003</creationdate><topic>Chips</topic><topic>Density</topic><topic>Diffraction gratings</topic><topic>Electron optics</topic><topic>Gratings (spectra)</topic><topic>Interconnections</topic><topic>Joining</topic><topic>Optical coupling</topic><topic>Optical interconnections</topic><topic>Optical polymers</topic><topic>Optical refraction</topic><topic>Optical surface waves</topic><topic>Optical waveguides</topic><topic>Pillars</topic><topic>Scanning electron microscopy</topic><topic>Sockets</topic><topic>Surface waves</topic><toplevel>online_resources</toplevel><creatorcontrib>Bakir, M.S.</creatorcontrib><creatorcontrib>Gaylord, T.K.</creatorcontrib><creatorcontrib>Martin, K.P.</creatorcontrib><creatorcontrib>Meindl, J.D.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE photonics technology letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bakir, M.S.</au><au>Gaylord, T.K.</au><au>Martin, K.P.</au><au>Meindl, J.D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections</atitle><jtitle>IEEE photonics technology letters</jtitle><stitle>LPT</stitle><date>2003-11-01</date><risdate>2003</risdate><volume>15</volume><issue>11</issue><spage>1567</spage><epage>1569</epage><pages>1567-1569</pages><issn>1041-1135</issn><eissn>1941-0174</eissn><coden>IPTLEL</coden><abstract>An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10 5 /cm 2 . The compliance of the polymer pillars is shown to be 3-5 μm/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/LPT.2003.818651</doi><tpages>3</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1041-1135 |
| ispartof | IEEE photonics technology letters, 2003-11, Vol.15 (11), p.1567-1569 |
| issn | 1041-1135 1941-0174 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_901666873 |
| source | IEEE Electronic Library (IEL) |
| subjects | Chips Density Diffraction gratings Electron optics Gratings (spectra) Interconnections Joining Optical coupling Optical interconnections Optical polymers Optical refraction Optical surface waves Optical waveguides Pillars Scanning electron microscopy Sockets Surface waves |
| title | Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T02%3A42%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Sea%20of%20polymer%20pillars:%20compliant%20wafer-level%20electrical-optical%20chip%20I/O%20interconnections&rft.jtitle=IEEE%20photonics%20technology%20letters&rft.au=Bakir,%20M.S.&rft.date=2003-11-01&rft.volume=15&rft.issue=11&rft.spage=1567&rft.epage=1569&rft.pages=1567-1569&rft.issn=1041-1135&rft.eissn=1941-0174&rft.coden=IPTLEL&rft_id=info:doi/10.1109/LPT.2003.818651&rft_dat=%3Cproquest_RIE%3E901666873%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=884238996&rft_id=info:pmid/&rft_ieee_id=1237590&rfr_iscdi=true |