Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections

Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections

An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatc...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE photonics technology letters 2003-11, Vol.15 (11), p.1567-1569
Hauptverfasser: Bakir, M.S., Gaylord, T.K., Martin, K.P., Meindl, J.D.
Format: Artikel
Sprache:eng
Schlagworte:
Chips
Density
Diffraction gratings
Electron optics
Gratings (spectra)
Interconnections
Joining
Optical coupling
Optical interconnections
Optical polymers
Optical refraction
Optical surface waves
Optical waveguides
Pillars
Scanning electron microscopy
Sockets
Surface waves
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10 5 /cm 2 . The compliance of the polymer pillars is shown to be 3-5 μm/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2003.818651