High thermal conductive epoxy molding compound with thermal conductive pathway

The epoxy molding compound (EMC) with thermal conductive pathways was developed by structure designing. Three kinds of EMCs with different thermal conductivities were used in this investigation, specifically epoxy filled with Si₃N₄, filled with hybrid Si₃N₄/SiO₂, and filled with SiO₂. Improved thermal conductivity was achieved by constructing thermal conductive pathways using high thermal conductivity EMC (Si₃N₄) in low thermal conductivity EMC (SiO₂). The morphology and microstructure of the top of EMC indicate that continuous network is formed by the filler which anticipates heat conductivity. The highest thermal conductivity of the EMC was 2.5 W/m K, reached when the volume fraction of EMC (Si₃N₄) is 80% (to compare with hybrid Si₃N₄/SiO₂ filled-EMC, the content of total fillers in the EMC was kept at 60 vol %). For a given volume fraction of EMC (Si₃N₄) in the EMC system, thermal conductivity values increase according to the order EMC (Si₃N₄) particles filled-EMC, hybrid Si₃N₄/SiO₂ filled-EMC, and EMC(SiO₂) particles filled-EMC. The coefficient of thermal expansion (CTE) decreases with increasing Si₃N₄ content in the whole filler. The values of CTE ranged between 23 x 10⁻⁶ and 30 x 10⁻⁶ K⁻¹. The investigated EMC samples have a flexural strength of about 36-39 MPa. The dielectric constant increases with Si₃N₄ content but generally remains at a low level (