Micromechanics and Advanced Designs for Curved Photodetector Arrays in Hemispherical Electronic-Eye Cameras

The fabrication of a hemispherical electronic‐eye camera with optimized designs based upon micromechanical analysis is reported. The photodetector arrays combine layouts with multidevice tiles and extended, non‐coplanar interconnects to improve the fill factor and deformability, respectively. Quantitative comparison to micromechanics analysis reveals the key features of these designs. Color images collected with working cameras demonstrate the utility of these approaches. The fabrication of a hemispherical electronic‐eye camera with optimized designs based upon micromechanical analysis is reported. The photodetector arrays combine layouts with multidevice tiles and extended, non‐coplanar interconnects to improve the fill factor and deformability, respectively.