A three-dimensional neural recording microsystem with implantable data compression circuitry
A 256-site, fully implantable, 3-D neural recording microsystem has been developed. The microsystem incorporates four active neural probes with integrated circuitry for site selection, amplification, and multiplexing. The probes drive an embedded data-compression ASIC that successfully detects neura...
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| Veröffentlicht in: | IEEE journal of solid-state circuits 2005-12, Vol.40 (12), p.2796-2804 |
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| container_end_page | 2804 |
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| container_issue | 12 |
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| container_title | IEEE journal of solid-state circuits |
| container_volume | 40 |
| creator | Olsson, R.H. Wise, K.D. |
| description | A 256-site, fully implantable, 3-D neural recording microsystem has been developed. The microsystem incorporates four active neural probes with integrated circuitry for site selection, amplification, and multiplexing. The probes drive an embedded data-compression ASIC that successfully detects neural spikes in the presence of neural and circuit noise. The spike detection ASIC achieves a factor of 12 bandwidth reduction while preserving the key features of the action potential waveshape necessary for spike discrimination. This work extends the total number of neural channels that can be recorded across a transcutaneous inductively coupled wireless link from 25 to 312. When a spike is detected, this ASIC serially shifts the 5-bit amplitude and 5-bit address of the spike off of the chip over a single 2.5 Mb/s wired or wireless line. The spike detection ASIC occupies 6 mm/sup 2/ in 0.5 /spl mu/m features and consumes 2.6 mW while the entire microsystem consumes 5.4 mW of power from a 3-V supply. |
| doi_str_mv | 10.1109/JSSC.2005.858479 |
| format | Article |
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The microsystem incorporates four active neural probes with integrated circuitry for site selection, amplification, and multiplexing. The probes drive an embedded data-compression ASIC that successfully detects neural spikes in the presence of neural and circuit noise. The spike detection ASIC achieves a factor of 12 bandwidth reduction while preserving the key features of the action potential waveshape necessary for spike discrimination. This work extends the total number of neural channels that can be recorded across a transcutaneous inductively coupled wireless link from 25 to 312. When a spike is detected, this ASIC serially shifts the 5-bit amplitude and 5-bit address of the spike off of the chip over a single 2.5 Mb/s wired or wireless line. 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Testing ; Electric, optical and optoelectronic circuits ; Electronic circuits ; Electronics ; Exact sciences and technology ; Integrated circuit interconnections ; Integrated circuits ; microelectrodes ; microsensors ; Nervous system ; Neural prosthesis ; Neurons ; Probes ; Prosthetics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; time division multiplexing</subject><ispartof>IEEE journal of solid-state circuits, 2005-12, Vol.40 (12), p.2796-2804</ispartof><rights>2006 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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The microsystem incorporates four active neural probes with integrated circuitry for site selection, amplification, and multiplexing. The probes drive an embedded data-compression ASIC that successfully detects neural spikes in the presence of neural and circuit noise. The spike detection ASIC achieves a factor of 12 bandwidth reduction while preserving the key features of the action potential waveshape necessary for spike discrimination. This work extends the total number of neural channels that can be recorded across a transcutaneous inductively coupled wireless link from 25 to 312. When a spike is detected, this ASIC serially shifts the 5-bit amplitude and 5-bit address of the spike off of the chip over a single 2.5 Mb/s wired or wireless line. The spike detection ASIC occupies 6 mm/sup 2/ in 0.5 /spl mu/m features and consumes 2.6 mW while the entire microsystem consumes 5.4 mW of power from a 3-V supply.</description><subject>Amplifiers</subject><subject>Application specific integrated circuits</subject><subject>Applied sciences</subject><subject>Bioelectric phenomena</subject><subject>bioelectric potentials</subject><subject>biomedical signal detection</subject><subject>biomedical signal processing</subject><subject>Circuit properties</subject><subject>Control systems</subject><subject>Data compression</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronic circuits</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Integrated circuit interconnections</subject><subject>Integrated circuits</subject><subject>microelectrodes</subject><subject>microsensors</subject><subject>Nervous system</subject><subject>Neural prosthesis</subject><subject>Neurons</subject><subject>Probes</subject><subject>Prosthetics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>time division multiplexing</subject><issn>0018-9200</issn><issn>1558-173X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp9kc1LxDAQxYMouK7eBS9FUE9dkyZpk-Oy-MmCh92DByGk6dTN0o81aZH9702psODBywzD_OYxvIfQJcEzQrC8f12tFrMEYz4TXLBMHqEJ4VzEJKPvx2iCMRGxDPtTdOb9NoyMCTJBH_Oo2ziAuLA1NN62ja6iBnoXmgPTusI2n1FtjWv93ndQR9-220S23lW66XReQVToTkemrXcO_CAQGetMbzu3P0cnpa48XPz2KVo_PqwXz_Hy7ellMV_GhgraxZxRXjIhWJkSnUNaCpFTgYGGUmBGOMg0M5qXhRZc5qagRssccpJkZSpzOkV3o-zOtV89-E7V1huowofQ9l4JmSYEM5kE8vZfMhEkOChxAK__gNu2d8EbryQJLgqeDBAeocEc76BUO2dr7faKYDWEooZQ1BCKGkMJJze_utobXZVON8b6w11GccopDdzVyFkAOKw5S5Pg1g87ApZn</recordid><startdate>20051201</startdate><enddate>20051201</enddate><creator>Olsson, R.H.</creator><creator>Wise, K.D.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7TK</scope></search><sort><creationdate>20051201</creationdate><title>A three-dimensional neural recording microsystem with implantable data compression circuitry</title><author>Olsson, R.H. ; Wise, K.D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c383t-5435f4884f61abe6f88b380e3380d0415e967ca5fda859bcd3ca9beb127f69b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Amplifiers</topic><topic>Application specific integrated circuits</topic><topic>Applied sciences</topic><topic>Bioelectric phenomena</topic><topic>bioelectric potentials</topic><topic>biomedical signal detection</topic><topic>biomedical signal processing</topic><topic>Circuit properties</topic><topic>Control systems</topic><topic>Data compression</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronic circuits</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integrated circuit interconnections</topic><topic>Integrated circuits</topic><topic>microelectrodes</topic><topic>microsensors</topic><topic>Nervous system</topic><topic>Neural prosthesis</topic><topic>Neurons</topic><topic>Probes</topic><topic>Prosthetics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>time division multiplexing</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Olsson, R.H.</creatorcontrib><creatorcontrib>Wise, K.D.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Neurosciences Abstracts</collection><jtitle>IEEE journal of solid-state circuits</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Olsson, R.H.</au><au>Wise, K.D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A three-dimensional neural recording microsystem with implantable data compression circuitry</atitle><jtitle>IEEE journal of solid-state circuits</jtitle><stitle>JSSC</stitle><date>2005-12-01</date><risdate>2005</risdate><volume>40</volume><issue>12</issue><spage>2796</spage><epage>2804</epage><pages>2796-2804</pages><issn>0018-9200</issn><eissn>1558-173X</eissn><coden>IJSCBC</coden><abstract>A 256-site, fully implantable, 3-D neural recording microsystem has been developed. The microsystem incorporates four active neural probes with integrated circuitry for site selection, amplification, and multiplexing. The probes drive an embedded data-compression ASIC that successfully detects neural spikes in the presence of neural and circuit noise. The spike detection ASIC achieves a factor of 12 bandwidth reduction while preserving the key features of the action potential waveshape necessary for spike discrimination. This work extends the total number of neural channels that can be recorded across a transcutaneous inductively coupled wireless link from 25 to 312. When a spike is detected, this ASIC serially shifts the 5-bit amplitude and 5-bit address of the spike off of the chip over a single 2.5 Mb/s wired or wireless line. The spike detection ASIC occupies 6 mm/sup 2/ in 0.5 /spl mu/m features and consumes 2.6 mW while the entire microsystem consumes 5.4 mW of power from a 3-V supply.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/JSSC.2005.858479</doi><tpages>9</tpages><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Amplifiers Application specific integrated circuits Applied sciences Bioelectric phenomena bioelectric potentials biomedical signal detection biomedical signal processing Circuit properties Control systems Data compression Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronic circuits Electronics Exact sciences and technology Integrated circuit interconnections Integrated circuits microelectrodes microsensors Nervous system Neural prosthesis Neurons Probes Prosthetics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices time division multiplexing |
| title | A three-dimensional neural recording microsystem with implantable data compression circuitry |
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