Experimental Investigations on Ice Bonded Abrasive Polishing of Copper Materials

In this article, an attempt is made to prepare an ice-bonded abrasive polishing (IBAP) tool, in situ, for ultrafine finishing of flat, Electrolytic Copper (EC)-grade copper specimen. Two different methods such as direct and layer-by-layer methods of freezing slurry were tried for preparation of the IBAP tool. Tools prepared by both these methods were characterized to analyze the distribution of abrasives in ice matrix. Polishing experiments were conducted on copper specimen by varying the rotational speed of tool, concentration of silicon carbide abrasives in slurry, contact pressure between tool and work surface, each at two levels. By analyzing the polished surfaces with an optical profilometer and scanning electron microscope, the mechanisms of material removal and surface generation processes are understood.