Ion-implanted resist removal using atomic hydrogen
We removed B-, P-, and As-ion-implanted positive-tone novolak resists with an implantation dose of 5 × 10 12 to 5 × 10 15 atoms/cm 2 at 70 keV, using atomic hydrogen. Though the removal rate decreased with increase in the implantation dose, all of the ion-implanted resists were removed. The rates of...
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Veröffentlicht in: | Thin solid films 2011-05, Vol.519 (14), p.4578-4581 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | We removed B-, P-, and As-ion-implanted positive-tone novolak resists with an implantation dose of 5
×
10
12 to 5
×
10
15 atoms/cm
2 at 70
keV, using atomic hydrogen. Though the removal rate decreased with increase in the implantation dose, all of the ion-implanted resists were removed. The rates of thickness of the surface-hardened layer/all resist layer of B, P, and As implanted resists were 0.38, 0.26, and 0.16, respectively, by SEM observation. The removal rate decreased with increasing the rate of the surface-hardened layer. The energy supplied from the ions to the resist concentrated on the surface side in the increasing order of B-P-As. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2011.01.287 |