Design and fabrication of a transmitter optical subassembly (TOSA) in 10-gb/s small-form-factor pluggable (XFP) transceiver

A smart and compact packaging transmitter optical subassembly (TOSA) in a 10-Gb/s small-form-factor pluggable (XFP) transceiver module has been developed with an eye towards electrical and thermal performances. In the TOSA, a bias-tee circuit and a matching resistor are monolithically integrated on...

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Veröffentlicht in:IEEE journal of selected topics in quantum electronics 2006-07, Vol.12 (4), p.776-782
Hauptverfasser: Kim, Dongchurl, Shim, Jongin, Keh, Yong-Chan, Park, Munkyu
Format: Artikel
Sprache:eng
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Zusammenfassung:A smart and compact packaging transmitter optical subassembly (TOSA) in a 10-Gb/s small-form-factor pluggable (XFP) transceiver module has been developed with an eye towards electrical and thermal performances. In the TOSA, a bias-tee circuit and a matching resistor are monolithically integrated on an AlN submount with high thermal conductivity, and a newly proposed coplanar waveguide is drawn in a transistor outline (TO)-stem. In order to improve the electrical performance of the TOSA, the equivalent circuit model of all optoelectronic components in the TOSA is introduced and utilized. The fabricated TOSA shows the -3-dB bandwidth as high as 11 GHz and 0.36-dB penalty after a 75-km transmission at an elevated temperature of 85degC
ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2006.876184