The role of interfacial interactions on the glass-transition and viscoelastic properties of silica/polystyrene nanocomposite

Filler surface properties and polymer–filler interactions have dominate influence on viscoelastic behavior of polymeric matrix composites. When the filler–filler spacing is on the order of the polymeric matrix molecular size, fillers may agglomerate through direct short-range interactions, also by o...

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Veröffentlicht in:Composites science and technology 2011-05, Vol.71 (8), p.1039-1045
Hauptverfasser: Mortezaei, Mehrzad, Famili, Mohammad Hossein Navid, Kokabi, Mehrdad
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Sprache:eng
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Zusammenfassung:Filler surface properties and polymer–filler interactions have dominate influence on viscoelastic behavior of polymeric matrix composites. When the filler–filler spacing is on the order of the polymeric matrix molecular size, fillers may agglomerate through direct short-range interactions, also by overlapping of interfacial layers of neighboring fillers. In this work the effect of interfacial layer on the viscoelastic properties of silica/polystyrene composite was investigated. The Si/Ps nanocomposites were prepared by solution mixing method, and dynamic rheometry was employed to determine the viscoelastic behavior in the melt state. Experimental results show that, addition of silica nanoparticles to polystyrene matrix would increase the glass-transition temperature of polymer. This increasing will be accelerated by presence of nanoparticles with more filler–polymer adhesion energy, because of more interfacial layer volume fraction. It is helpful in evaluating the volume fraction and equivalent thickness of interfacial layer in polymer nanocomposites. Likewise it is shown that, the dynamic moduli of nanocomposite is enhanced associated with the increase in the glass-transition temperature. This study implies that the main source of increment in both dynamic modulus and glass-transition temperature of polymer nanocomposites is the presence of the immobilized interfacial layer and the secondary filler network.
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2011.02.012