Solidification mechanism transition of liquid Co–Cu–Ni ternary alloy

We report a solidification mechanism transition of liquid ternary Co 45 Cu 45 Ni 10 alloy when it solidifies at a critical undercooling of about 344 K. When undercooling at Δ T 344 K, the solidification velocity decreases with the increase of undercooling. In this case, liquid/liquid phase separation takes place prior to solidification. The minor L 2 (Cu) droplets hinder the motion of the solidification front, and a monotectic transition may occur in the major L 1 phase. These facts caused by metastable phase separation are responsible for the slow growth at high undercoolings.