Optical Interconnection Platform Composed of Fiber-Embedded Board, 90 ^-Bent Fiber Block, and 10-Gb/s Optical Module

An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) and 90-bent fiber connector. The passive assembling...

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Veröffentlicht in:Journal of lightwave technology 2008-06, Vol.26 (11), p.1479-1485
Hauptverfasser: Hwang, Sung Hwan, Cho, Mu Hee, Kang, Sae-Kyoung, Cho, Han Seo, Lee, Tae-Woo, Park, Hyo-Hoon
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Sprache:eng
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Zusammenfassung:An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) and 90-bent fiber connector. The passive assembling was achieved by employing the guide pins/holes of commercialized ferrules in the optical link between the OPCB, 90-bent fiber connector, and the transmitter/receiver (Tx/Rx) module. From this interconnection scheme, a low total optical loss of was obtained. From an assembled platform with 10 Gb/s/ch 4 ch Tx/Rx modules, a 7-Gb/s/ch data transmission was demonstrated with a bit error rate below , involving the optical and electrical crosstalk arisen in the whole channel operation.
ISSN:0733-8724
1558-2213
DOI:10.1109/JLT.2008.922166