Process Optimization and Downscaling of a Single-Electron Single Dot Memory

This paper presents the process optimization of a single-electron nanoflash electron memory. Self-aligned single dot memory structures have been fabricated using a wet anisotropic oxidation of a silicon nanowire. One of the main issue was to clarify the process conditions for the dot formation. Base...

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Veröffentlicht in:IEEE transactions on nanotechnology 2009-11, Vol.8 (6), p.737-748
Hauptverfasser: Krzeminski, C., Xiaohui Tang, Reckinger, N., Bayot, V., Dubois, E.
Format: Artikel
Sprache:eng
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Zusammenfassung:This paper presents the process optimization of a single-electron nanoflash electron memory. Self-aligned single dot memory structures have been fabricated using a wet anisotropic oxidation of a silicon nanowire. One of the main issue was to clarify the process conditions for the dot formation. Based on the process modeling, the influence of various parameters (oxidation temperature, nanowire shape) has been investigated. The necessity of a sharp compromise between these different parameters to ensure the presence of the memory dot has been established. In order to propose an aggressive memory cell, the downscaling of the device has been carefully studied. Scaling rules show that the size of the original device could be reduced by a factor of 2. This point has been previously confirmed by the realization of single-electron memory devices.
ISSN:1536-125X
1941-0085
DOI:10.1109/TNANO.2009.2021653