Simulation of the Time Evolution Profiles in Nanoimprint Lithography

To study the time dependence of the resist profiles in nanoimprint lithography, numerical simulation has been done by using conventional finite element method, where the resist is assumed as a viscous fluid body over the glass transition temperature. On the other hand, the resist shape is quenched by rapid cooling just after pressing the resist. Time dependent resist profiles are experimentally observed for various pressing times. The resist filling rate into the mold cavity is evaluated and they relatively agree with each other qualitatively. Also, the dependence of the time evolutions on the aspect ratio of the mold groove is simulated and there exist minimum aspect ratio to shorten the process time.