Application of C sub(60) to Photosensitive Diazo /PVA Resist

Degradation temperature, D.T. of the para-substituted benzene diazo compound (SBD) incorporated with fullerene (C sub(60)) or inclusion compounds ; 18-crown-6 and polyethylene glycol 300 (PEG), was determined by TDA and DTA in solid. The D.T. of SBD with 18C6 was higher than that with C sub(60). The D.T. of SBD with C sub(60) was higher and that of SBD with PEG was lower than that without C sub(60) or PEG. 18C6 includes a diazo group, but C sub(60) incorporates or co-ordinates diazo compounds. Stabilization energies of diazo compound with C sub(60) (1:1) and (1:2) were calculated by WinMOPAC , to be -1.7 and -4.4 kcal, respectively. Photodecomposition rate of PVA resist films containing diphenyl-4-diazonium sulfate salts / formaldehyde condensate (DSR) with C sub(60) was as large as that without C sub(60). Photo decomposition rate of DSR/PVA resist with 18C6 was smaller than that without 18C6. Hardness of resist layers containing 1/10 and 1/1 C sub(60) (to the weight of diazo) was 2% and 20 % harder than that without C sub(60), respectively.