Role of Poly(diallyldimethylammonium chloride) in Selective Polishing of Polysilicon over Silicon Dioxide and Silicon Nitride Films

A cationic polymer, poly(diallyldimethylammonium chloride), or PDADMAC (MW ≈ 200 000), at a concentration of 250 ppm was used to enhance polysilicon removal rates (RRs) to ∼600 nm/min while simultaneously suppressing both silicon dioxide and silicon nitride RRs to

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Bibliographische Detailangaben
Veröffentlicht in:	Langmuir 2011-04, Vol.27 (7), p.3502-3510
Hauptverfasser:	Penta, Naresh K, Dandu Veera, P. R, Babu, S. V
Format:	Artikel
Sprache:	eng
Schlagworte:	Chemistry Exact sciences and technology General and physical chemistry Interfaces: Adsorption, Reactions, Films, Forces Solid-liquid interface Surface physical chemistry
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	A cationic polymer, poly(diallyldimethylammonium chloride), or PDADMAC (MW ≈ 200 000), at a concentration of 250 ppm was used to enhance polysilicon removal rates (RRs) to ∼600 nm/min while simultaneously suppressing both silicon dioxide and silicon nitride RRs to
ISSN:	0743-7463 1520-5827
DOI:	10.1021/la104257k