Transfer of Functional Ceramic Thin Films Using a Thermal Release Process

Transfer of Functional Ceramic Thin Films Using a Thermal Release Process

A simple, solder‐based bonding and lift‐off process for transfer of functional ceramic thin films is demonstrated. The process allows transfer of thin films from a growth wafer onto a target substrate in a single step, with separation from the growth substrate being driven by induced stresses during...

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Veröffentlicht in:Advanced materials (Weinheim) 2011-03, Vol.23 (10), p.1252-1256
Hauptverfasser: Dou, Guangbin, Holmes, Andrew S., Yeatman, Eric M., Wright, Robert V., Kirby, Paul B., Yin, Chunyan
Format: Artikel
Sprache:eng
Schlagworte:
Ceramics - chemistry
Electroplating
ferroelectric materials
lead zirconate titanate
sensors
Silicon - chemistry
thin films
Titanium - chemistry
Zirconium - chemistry
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Zusammenfassung:A simple, solder‐based bonding and lift‐off process for transfer of functional ceramic thin films is demonstrated. The process allows transfer of thin films from a growth wafer onto a target substrate in a single step, with separation from the growth substrate being driven by induced stresses during soldering. Free‐standing films can also be produced.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.201004391