Effect of fluorine interface redistribution on performance of AlGaN/GaN HEMTs

The effect of fluorine interface redistribution on dc and microwave performances of SF 6 plasma-treated AlGaN/GaN high-electron mobility transistors (HEMTs) was investigated. Selective SF 6 plasma treatment of the AlGaN/GaN HEMT gate interface yielded increases in the current gain cut-off frequency...

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Veröffentlicht in:Microelectronic engineering 2011-02, Vol.88 (2), p.166-169
Hauptverfasser: Lalinský, T., Vanko, G., Vincze, A., Haščík, Š., Osvald, J., Donoval, D., Tomáška, M., Kostič, I.
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Sprache:eng
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Zusammenfassung:The effect of fluorine interface redistribution on dc and microwave performances of SF 6 plasma-treated AlGaN/GaN high-electron mobility transistors (HEMTs) was investigated. Selective SF 6 plasma treatment of the AlGaN/GaN HEMT gate interface yielded increases in the current gain cut-off frequency ( f T) and maximum frequency of oscillation ( f max) of almost 60%. Annealing induced fluorine interface redistribution showed a low impact on the electron drift mobility and a negligible impact on the peak transconductance of the HEMTs. A large impact of the fluorine interface redistribution was observed for the threshold voltage and sheet carrier concentration of two-dimensional electron gas (2DEG). Consequently, it led to a decrease in the f T and f max values, but the values were still higher than those of conventional reference HEMTs.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2010.10.005