Adhesive bonding of microfluidic chips: influence of process parameters

In this note, the influence of process parameters for adhesive bonding as a versatile approach for the sealing of polymer microfluidic chips is investigated. Specifically, a process chain comprising pre-processing, adhesive transfer as well as post-processing is presented and parameter recommendatio...

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Veröffentlicht in:	Journal of micromechanics and microengineering 2010-08, Vol.20 (8), p.087003-087003
Hauptverfasser:	Riegger, Lutz, Strohmeier, Oliver, Faltin, Bernd, Zengerle, Roland, Koltay, Peter
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Applied fluid mechanics Applied sciences Channels Chips Devices Electronics Exact sciences and technology Fluid dynamics Fluidics Fundamental areas of phenomenology (including applications) Instruments, apparatus, components and techniques common to several branches of physics and astronomy Laminates Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Microfluidics Micromechanical devices and systems Physics Precision engineering, watch making Process parameters Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Thin films
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