Adhesive bonding of microfluidic chips: influence of process parameters

In this note, the influence of process parameters for adhesive bonding as a versatile approach for the sealing of polymer microfluidic chips is investigated. Specifically, a process chain comprising pre-processing, adhesive transfer as well as post-processing is presented and parameter recommendations are provided. As a device for adhesive transfer, a modified laminator is utilized which transfers thin layers of adhesive onto the chip surface, only via a silicone roll. Using this device and a high temperature (Tg > 100 degree C) epoxy adhesive, adhesive layers in the range of 2--4 mu m can be reproducibly transferred (CV < 4%). For best bonding results, it is recommended to provide 2.5 mu m thin layers of adhesive in combination with a subsequent evacuation step at 10 mbar for 3 h. Further, it is proposed to integrate capture channels near large, featureless areas to compensate for variations in processing and thus prevent clogging of channels.