The ROM Design with Half Grouping Compression Method for Chip Area and Power Consumption Reduction

In memory design, the issue is smaller size and low power. Most power used in the ROM is consumed in line capacitance such as address lines, word lines, bit lines, and decoder. This paper presents ROM design of a novel HG (Half Grouping) compression method so as to reduce the parasitic capacitance o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEICE Transactions on Electronics 2009/03/01, Vol.E92.C(3), pp.352-355
Hauptverfasser: JUNG, Ki-Sang, KIM, Kang-Jik, KIM, Young-Eun, CHUNG, Jin-Gyun, PYUN, Ki-Hyun, LEE, Jong-Yeol, JEONG, Hang-Geun, CHO, Seong-Ik
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In memory design, the issue is smaller size and low power. Most power used in the ROM is consumed in line capacitance such as address lines, word lines, bit lines, and decoder. This paper presents ROM design of a novel HG (Half Grouping) compression method so as to reduce the parasitic capacitance of bit lines and the area of the row decoder for power consumption and chip area reduction. ROM design result of 512 point FFT block shows that the proposed method reduces 40.6% area, 42.12% power, and 37.82% transistor number respectively in comparison with the conventional method. The designed ROM with proposed method is implemented in a 0.35µm CMOS process. It consumes 5.8mW at 100MHz with a single 3.3V power supply.
ISSN:0916-8524
1745-1353
1745-1353
DOI:10.1587/transele.E92.C.352