Observation of Tin Plated Fretting Contacts Using FIB-SEM
In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm.
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| Veröffentlicht in: | IEICE Transactions on Electronics 2010/09/01, Vol.E93.C(9), pp.1452-1455 |
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| container_end_page | 1455 |
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| container_issue | 9 |
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| container_title | IEICE Transactions on Electronics |
| container_volume | E93.C |
| creator | ITO, Tetsuya NOMURA, Yoshiyuki HATTORI, Yasuhiro |
| description | In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm. |
| doi_str_mv | 10.1587/transele.E93.C.1452 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_831174599</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>831174599</sourcerecordid><originalsourceid>FETCH-LOGICAL-c546t-e9585271bf380978db187731fc6cccc311260b63163f46ee498f6708039041be3</originalsourceid><addsrcrecordid>eNpdkMFOwzAMhiMEEmPwBFx6QZxakiZNkyNUG0wMDYntHKWZOzp17UgyJN6eVBs94Itl6fNn-UfoluCEZCJ_8Fa3DhpIJpImRUJYlp6hEclZFhOa0XM0wpLwWGQpu0RXzm0xJiIldITkonRgv7WvuzbqqmhZt9F7oz2so6kF7-t2ExVd67XxLlq5fpzOnuKPyds1uqh04-Dm1MdoNZ0si5d4vnieFY_z2GSM-xhkFs7mpKyowDIX65KIPKekMtyEooSkHJecEk4rxgGYFBXPscBUYkZKoGN0f_Tubfd1AOfVrnYGmka30B2cEkERHpUykPRIGts5Z6FSe1vvtP1RBKs-J_WXkwo5qUL1OYWtu5NfO6ObKiCmdsNqShlnKROBez1yW-f1BgZAW1-boPznlkPvrwyU-dRWQUt_Af6vg7k</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>831174599</pqid></control><display><type>article</type><title>Observation of Tin Plated Fretting Contacts Using FIB-SEM</title><source>J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese</source><creator>ITO, Tetsuya ; NOMURA, Yoshiyuki ; HATTORI, Yasuhiro</creator><creatorcontrib>ITO, Tetsuya ; NOMURA, Yoshiyuki ; HATTORI, Yasuhiro</creatorcontrib><description>In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm.</description><identifier>ISSN: 0916-8524</identifier><identifier>ISSN: 1745-1353</identifier><identifier>EISSN: 1745-1353</identifier><identifier>DOI: 10.1587/transele.E93.C.1452</identifier><language>eng</language><publisher>Oxford: The Institute of Electronics, Information and Communication Engineers</publisher><subject>Applied sciences ; Electronics ; Exact sciences and technology ; FIB-SEM ; Fretting ; Ion beams ; Microelectronic fabrication (materials and surfaces technology) ; Plating ; Scanning electron microscopy ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Spatial distribution ; Tin ; Tin oxides ; tin plating thickness</subject><ispartof>IEICE Transactions on Electronics, 2010/09/01, Vol.E93.C(9), pp.1452-1455</ispartof><rights>2010 The Institute of Electronics, Information and Communication Engineers</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c546t-e9585271bf380978db187731fc6cccc311260b63163f46ee498f6708039041be3</citedby><cites>FETCH-LOGICAL-c546t-e9585271bf380978db187731fc6cccc311260b63163f46ee498f6708039041be3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,780,784,789,790,1883,4024,4050,4051,23930,23931,25140,27923,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=23464248$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>ITO, Tetsuya</creatorcontrib><creatorcontrib>NOMURA, Yoshiyuki</creatorcontrib><creatorcontrib>HATTORI, Yasuhiro</creatorcontrib><title>Observation of Tin Plated Fretting Contacts Using FIB-SEM</title><title>IEICE Transactions on Electronics</title><addtitle>IEICE Trans. Electron.</addtitle><description>In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>FIB-SEM</subject><subject>Fretting</subject><subject>Ion beams</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Plating</subject><subject>Scanning electron microscopy</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Spatial distribution</subject><subject>Tin</subject><subject>Tin oxides</subject><subject>tin plating thickness</subject><issn>0916-8524</issn><issn>1745-1353</issn><issn>1745-1353</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNpdkMFOwzAMhiMEEmPwBFx6QZxakiZNkyNUG0wMDYntHKWZOzp17UgyJN6eVBs94Itl6fNn-UfoluCEZCJ_8Fa3DhpIJpImRUJYlp6hEclZFhOa0XM0wpLwWGQpu0RXzm0xJiIldITkonRgv7WvuzbqqmhZt9F7oz2so6kF7-t2ExVd67XxLlq5fpzOnuKPyds1uqh04-Dm1MdoNZ0si5d4vnieFY_z2GSM-xhkFs7mpKyowDIX65KIPKekMtyEooSkHJecEk4rxgGYFBXPscBUYkZKoGN0f_Tubfd1AOfVrnYGmka30B2cEkERHpUykPRIGts5Z6FSe1vvtP1RBKs-J_WXkwo5qUL1OYWtu5NfO6ObKiCmdsNqShlnKROBez1yW-f1BgZAW1-boPznlkPvrwyU-dRWQUt_Af6vg7k</recordid><startdate>2010</startdate><enddate>2010</enddate><creator>ITO, Tetsuya</creator><creator>NOMURA, Yoshiyuki</creator><creator>HATTORI, Yasuhiro</creator><general>The Institute of Electronics, Information and Communication Engineers</general><general>Oxford University Press</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>2010</creationdate><title>Observation of Tin Plated Fretting Contacts Using FIB-SEM</title><author>ITO, Tetsuya ; NOMURA, Yoshiyuki ; HATTORI, Yasuhiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c546t-e9585271bf380978db187731fc6cccc311260b63163f46ee498f6708039041be3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Applied sciences</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>FIB-SEM</topic><topic>Fretting</topic><topic>Ion beams</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Plating</topic><topic>Scanning electron microscopy</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Spatial distribution</topic><topic>Tin</topic><topic>Tin oxides</topic><topic>tin plating thickness</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>ITO, Tetsuya</creatorcontrib><creatorcontrib>NOMURA, Yoshiyuki</creatorcontrib><creatorcontrib>HATTORI, Yasuhiro</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEICE Transactions on Electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>ITO, Tetsuya</au><au>NOMURA, Yoshiyuki</au><au>HATTORI, Yasuhiro</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Observation of Tin Plated Fretting Contacts Using FIB-SEM</atitle><jtitle>IEICE Transactions on Electronics</jtitle><addtitle>IEICE Trans. Electron.</addtitle><date>2010</date><risdate>2010</risdate><volume>E93.C</volume><issue>9</issue><spage>1452</spage><epage>1455</epage><pages>1452-1455</pages><issn>0916-8524</issn><issn>1745-1353</issn><eissn>1745-1353</eissn><abstract>In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm.</abstract><cop>Oxford</cop><pub>The Institute of Electronics, Information and Communication Engineers</pub><doi>10.1587/transele.E93.C.1452</doi><tpages>4</tpages></addata></record> |
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| ispartof | IEICE Transactions on Electronics, 2010/09/01, Vol.E93.C(9), pp.1452-1455 |
| issn | 0916-8524 1745-1353 1745-1353 |
| language | eng |
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| source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese |
| subjects | Applied sciences Electronics Exact sciences and technology FIB-SEM Fretting Ion beams Microelectronic fabrication (materials and surfaces technology) Plating Scanning electron microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spatial distribution Tin Tin oxides tin plating thickness |
| title | Observation of Tin Plated Fretting Contacts Using FIB-SEM |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T20%3A20%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Observation%20of%20Tin%20Plated%20Fretting%20Contacts%20Using%20FIB-SEM&rft.jtitle=IEICE%20Transactions%20on%20Electronics&rft.au=ITO,%20Tetsuya&rft.date=2010&rft.volume=E93.C&rft.issue=9&rft.spage=1452&rft.epage=1455&rft.pages=1452-1455&rft.issn=0916-8524&rft.eissn=1745-1353&rft_id=info:doi/10.1587/transele.E93.C.1452&rft_dat=%3Cproquest_cross%3E831174599%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=831174599&rft_id=info:pmid/&rfr_iscdi=true |