Observation of Tin Plated Fretting Contacts Using FIB-SEM

In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm.

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Bibliographische Detailangaben
Veröffentlicht in:	IEICE Transactions on Electronics 2010/09/01, Vol.E93.C(9), pp.1452-1455
Hauptverfasser:	ITO, Tetsuya, NOMURA, Yoshiyuki, HATTORI, Yasuhiro
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology FIB-SEM Fretting Ion beams Microelectronic fabrication (materials and surfaces technology) Plating Scanning electron microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Spatial distribution Tin Tin oxides tin plating thickness
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Beschreibung
Zusammenfassung:	In this report, Focused Ion Beam (FIB) — SEM technique was applied to observe the tin plated fretting contacts. Spatial distributions of tin, tin oxide and so on have been confirmed quantitatively in two plating thickness of 1 and 5µm.
ISSN:	0916-8524 1745-1353 1745-1353
DOI:	10.1587/transele.E93.C.1452