Bonding characteristics during very high power ultrasonic additive manufacturing of copper

Bonding characteristics during very high power ultrasonic additive manufacturing of copper

Welding of copper foils (150 μm thick) achieved at room temperature by very high power ultrasonic additive manufacturing was seen to involve appreciable softening and enhanced plastic flow. The initial coarse-grained structure (25 μm) in the material changed into fine dynamically recrystallized grai...

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Veröffentlicht in:Scripta materialia 2010-04, Vol.62 (8), p.560-563
Hauptverfasser: Sriraman, M.R., Babu, S.S., Short, M.
Format: Artikel
Sprache:eng
Schlagworte:
Additives
BONDING
Copper
DOPING
Dynamic recrystallization
Electron backscattering diffraction
Foils (structural shapes)
Grain boundary migration
GRAIN SIZE AND SHAPE
MANUFACTURE
Plastic flow
SOFTENING
Ultrasonic additive manufacturing
ULTRASONICS
WELDING
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Beschreibung
Zusammenfassung:Welding of copper foils (150 μm thick) achieved at room temperature by very high power ultrasonic additive manufacturing was seen to involve appreciable softening and enhanced plastic flow. The initial coarse-grained structure (25 μm) in the material changed into fine dynamically recrystallized grains (0.3–10 μm) at the foil interface within the order of a few milliseconds of processing. This phenomenon led to metallurgical bonding through grain boundary migration and allowed for successive welding of tapes to form a three-dimensional part.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2009.12.040