Synthesis of copper sulphide and copper nanoparticles with microemulsion method
The present work is focused on the synthesis of nanocopper and nanocopper sulphide metallic particles. The precise control of size and shape is best achievable with microemulsion technique, with in situ synthesis in microemulsion. The effect of most crucial operating parameter, water-to-surfactant m...
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Veröffentlicht in: | Solid state sciences 2010-09, Vol.12 (9), p.1560-1566 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The present work is focused on the synthesis of nanocopper and nanocopper sulphide metallic particles. The precise control of size and shape is best achievable with microemulsion technique, with
in situ synthesis in microemulsion. The effect of most crucial operating parameter, water-to-surfactant molar ratio (
w), on the product specification including size as well as size distribution and morphology were investigated. The variation of size was observed with variation in
w for copper sulphide and copper. Product specifications were analyzed using transmission electron microscope imaging, dynamic light scattering with particle size analyzer and absorption spectra using UV-visible spectrophotometer. It was observed that bigger particles were achieved at higher water-to-surfactant ratio. From systematic study of effect of
w on the size and size distribution of copper nanoparticles, the optimum value was chosen for preparation of
in situ catalyst. As copper on alumina catalyst has wide catalytic applications of commercial importance, alumina was selected as support. A novel deposition method is developed successfully to deposit the copper nanoparticles from microemulsion on the support. Thus prepared catalyst was analyzed with UV-visible spectrophotometer and found to contain characteristic peak of copper at 655
nm, indicating proper copper deposition on support. XRD analysis of copper on alumina catalyst confirmed presence of metallic copper.
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ISSN: | 1293-2558 1873-3085 |
DOI: | 10.1016/j.solidstatesciences.2010.06.021 |