Crystallization behavior caused by N doping in Ge1Sb4Te7 for PCRAM application
In this paper, we reported the effect of N doping on the crystallization behavior of Ge1Sb4Te7 thin films. It was clearly shown that the phase transition of Ge1Sb4Te7 occurred from amorphous to hexagonal state and meta-stable FCC state is shown between these phase transition processes. N doping effe...
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Veröffentlicht in: | Thin solid films 2010-09, Vol.518 (22), p.6422-6428 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | In this paper, we reported the effect of N doping on the crystallization behavior of Ge1Sb4Te7 thin films. It was clearly shown that the phase transition of Ge1Sb4Te7 occurred from amorphous to hexagonal state and meta-stable FCC state is shown between these phase transition processes. N doping effectively suppressed crystallization process and the crystal grain size was decreased from 21nm to 14nm with increasing N doping contents. N-doped film was found to have nucleation dominant crystallization process and the time demanded to start phase transition is shorter compared to un-doped film. In the case of the film deposited at 9A-10a 3 Torr without N doping, 70ns is required for crystallization to occur at 36mW of laser power, however, 30ns is required in the case of N-doped film. These results are demonstrated by X-ray diffraction (XRD), transmission electron microscopy (TEM) and static test. |
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ISSN: | 0040-6090 1879-2731 |
DOI: | 10.1016/j.tsf.2010.02.002 |