Fabrication of Submicrometer Features on Curved Substrates by Microcontact Printing

Microcontact printing (μCP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet chemical etching that uses the patterned SAMs as resists transfers the patterns formed by μCP into...

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Veröffentlicht in:	Science (American Association for the Advancement of Science) 1995-08, Vol.269 (5224), p.664-666
Hauptverfasser:	Jackman, Rebecca J., Wilbur, James L., Whitesides, George M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Chemistry, Physical - methods Circuit printing Dimethylpolysiloxanes - chemistry Electronics Etching Exact sciences and technology Gold Gold - chemistry Manufacturing Microelectronic fabrication (materials and surfaces technology) Microelectronics Miniature electronic equipment Nanotechnology Organic Chemistry Photographic lenses Postdoctoral Education Printed circuit board Printed circuit boards Printed circuits Printing Printing machinery Radius of curvature Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Shared Facilities Silicones - chemistry Surface Properties
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Beschreibung
Zusammenfassung:	Microcontact printing (μCP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet chemical etching that uses the patterned SAMs as resists transfers the patterns formed by μCP into gold. At present, there is no comparable method for microfabrication on curved surfaces.
ISSN:	0036-8075 1095-9203
DOI:	10.1126/science.7624795