New epoxy thermosets modified with hyperbranched poly(ester-amide) of different molecular weight

The influence of hydroxy-functionalized hyperbranched poly(ester-amide) (HBP) of different molecular weight on the curing process of diglycidylether of bisphenol A (DGEBA) was studied using methyltetrahydrophthalic anhydride (MTHPA) as curing agent. By Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) the curing reaction was monitored and the covalent incorporation of the modifier in the matrix was proved. By thermomechanical analysis (TMA) the reduction of the contraction after gelation on changing the HBP proportion was observed. The incorporation of HBP increased the glass transition temperature ( T g) and reduced the overall shrinkage. The modified materials showed a higher thermal degradability than neat DGEBA thermosets allowing reworkability. Thermal expansion coefficient, Young’s modulus, impact strength and microhardness were improved. The water uptake behavior was also evaluated.