Fabrication of system with probe for high-frequency measurement applications
In this study, a new type of low temperature co‐fired ceramic (LTCC) probes fabricated using the system‐in‐package (SiP) technology is proposed; these probes are used for high‐frequency measurements. The advantage of LTCC probes is that suitable structures of the metal tips of their electrodes can b...
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Veröffentlicht in: | Microwave and optical technology letters 2010-09, Vol.52 (9), p.2083-2087 |
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Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | In this study, a new type of low temperature co‐fired ceramic (LTCC) probes fabricated using the system‐in‐package (SiP) technology is proposed; these probes are used for high‐frequency measurements. The advantage of LTCC probes is that suitable structures of the metal tips of their electrodes can be easily created by cutting LTCC sheets during the fabrication process. © 2010 Wiley Periodicals, Inc. Microwave Opt Technol Lett 52: 2083–2087, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.25416 |
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ISSN: | 0895-2477 1098-2760 |
DOI: | 10.1002/mop.25416 |