Hybrid pixel detector based on capacitive chip to chip signal-transmission

Hybrid pixel-detectors for the detection of elementary particles without bump-interconnections will be presented. The signals, generated in the sensor chip, are transmitted using capacitive coupling to the readout chip. In order to ease the capacitive signal transmission, an active pixel sensor has...

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Veröffentlicht in:Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Accelerators, spectrometers, detectors and associated equipment, 2010-05, Vol.617 (1), p.576-581
Hauptverfasser: Perić, I., Kreidl, C., Fischer, P.
Format: Artikel
Sprache:eng
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Zusammenfassung:Hybrid pixel-detectors for the detection of elementary particles without bump-interconnections will be presented. The signals, generated in the sensor chip, are transmitted using capacitive coupling to the readout chip. In order to ease the capacitive signal transmission, an active pixel sensor has been used. The sensor chip is implemented in a standard CMOS high-voltage technology where lowly doped n-well in p-substrate diodes are used as pixel-sensors. CMOS in-pixel preamplifiers are implemented inside the n-wells. Experimental results obtained with two different hybrid detector prototypes will be presented.
ISSN:0168-9002
1872-9576
DOI:10.1016/j.nima.2009.09.042