Thickness and refractive index measurement of a silicon wafer based on an optical comb
We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase i...
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| Veröffentlicht in: | Optics express 2010-08, Vol.18 (17), p.18339-18346 |
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| container_issue | 17 |
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| container_title | Optics express |
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| creator | Jin, Jonghan Kim, Jae Wan Kang, Chu-Shik Kim, Jong-Ahn Eom, Tae Bong |
| description | We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase information obtained in the spectral domain. In a feasibility test, the geometrical thickness and refractive index of a wafer were measured to be 334.85 microm and 3.50, respectively. The measurement uncertainty for the geometrical thickness was evaluated as 0.95 microm (k = 1) using a preliminary setup. |
| doi_str_mv | 10.1364/OE.18.018339 |
| format | Article |
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| ispartof | Optics express, 2010-08, Vol.18 (17), p.18339-18346 |
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| language | eng |
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| source | MEDLINE; DOAJ Directory of Open Access Journals; EZB-FREE-00999 freely available EZB journals; Alma/SFX Local Collection |
| subjects | Infrared Rays Interferometry - instrumentation Interferometry - methods Lasers Models, Theoretical Optical Devices Refractometry - instrumentation Refractometry - methods Silicon - chemistry Spectrophotometry - instrumentation Spectrophotometry - methods |
| title | Thickness and refractive index measurement of a silicon wafer based on an optical comb |
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