Thickness and refractive index measurement of a silicon wafer based on an optical comb

We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase i...

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Veröffentlicht in:Optics express 2010-08, Vol.18 (17), p.18339-18346
Hauptverfasser: Jin, Jonghan, Kim, Jae Wan, Kang, Chu-Shik, Kim, Jong-Ahn, Eom, Tae Bong
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Sprache:eng
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Zusammenfassung:We have proposed and demonstrated a novel method that can determine both the geometrical thickness and refractive index of a silicon wafer at the same time using an optical comb. The geometrical thickness and refractive index of a silicon wafer was determined from the optical thickness using phase information obtained in the spectral domain. In a feasibility test, the geometrical thickness and refractive index of a wafer were measured to be 334.85 microm and 3.50, respectively. The measurement uncertainty for the geometrical thickness was evaluated as 0.95 microm (k = 1) using a preliminary setup.
ISSN:1094-4087
1094-4087
DOI:10.1364/OE.18.018339