Development of residual stress and mechanical behavior of c-BN-layers

Development of residual stress and mechanical behavior of c-BN-layers

To better understand the influence of layer defects on the adhesion strength of cubic boron nitride both computer simulations at a mesoscopic level and experimental analysis of fracture mechanical processes were carried out. This led to new important insights for obtaining higher adhesion strength a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Vakuum in Forschung und Praxis : Zeitschrift für Vakuumtechnologie, Oberflèachen und Dünne Schichten Oberflèachen und Dünne Schichten, 2001-06, Vol.13 (3), p.161-170
Hauptverfasser: Bobeth, M, Moller, J, Pompe, W, Reiche, D, Trommer, O, Ullrich, A
Format: Artikel
Sprache:eng ; ger
Schlagworte:
Adhesion
Bond strength (materials)
Computer simulation
Defects
Fracture mechanics
Residual stresses
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To better understand the influence of layer defects on the adhesion strength of cubic boron nitride both computer simulations at a mesoscopic level and experimental analysis of fracture mechanical processes were carried out. This led to new important insights for obtaining higher adhesion strength and was usefully incorporated in the processing of the layers.
ISSN:0947-076X