Robotic electroplating of gold on quaternary semiconductors

Robotic electroplating of gold on quaternary semiconductors

A new technique of electroplating which ensures the maintenance of highly uniform operating conditions is described. A small scale computer-controlled robot-arm is programmed to perform the complex sequence of tasks involved in electroplating gold on samples of quaternary semiconductors based on InP...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of applied electrochemistry 1983-07, Vol.13 (4), p.531-533
Hauptverfasser: Beni, G, Hackwood, S
Format: Artikel
Sprache:eng
Schlagworte:
automatic control
electroplating
gold
mechanical handling
robots
semiconductors
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A new technique of electroplating which ensures the maintenance of highly uniform operating conditions is described. A small scale computer-controlled robot-arm is programmed to perform the complex sequence of tasks involved in electroplating gold on samples of quaternary semiconductors based on InP. The technique eliminates the irreproducibility of many aspects of the plating process, including the control of bubble formation and current pulsation.
ISSN:0021-891X
1572-8838
DOI:10.1007/BF00617526