Design and fabrication of a microfluidic circuitboard

This paper reports the design and fabrication of a micromachined microfluidic circuitboard. The circuitboard consists of a Pyrex wafer in which trenches and connection holes are etched. Channels are then formed by anodically bonding a silicon wafer to the Pyrex wafer. On top of this, various microfluidic devices can be mounted via the anodic bonding technique. This allows a simple way of mass production of different microfluidic systems. To realize other microfluidic systems only the mask layout for creating the channels in the Pyrex wafer has to be changed. The microfluidic circuitboard has been successfully fabricated and single devices have been surface mounted. A whole system has been tested and it proved to be functional and without any leakage.