Wavelength Division Multiplexing Based Photonic Integrated Circuits on Silicon-on-Insulator Platform
We review recent advances in the development of silicon photonic integrated circuits for high-speed and high-capacity interconnect applications. We present detailed design, fabrication, and characterization of a silicon integrated chip based on wavelength division multiplexing. In such a chip, an ar...
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| Veröffentlicht in: | IEEE journal of selected topics in quantum electronics 2010-01, Vol.16 (1), p.23-32 |
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| container_title | IEEE journal of selected topics in quantum electronics |
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| creator | Ansheng Liu Ling Liao Chetrit, Y. Basak, J. Nguyen, H. Rubin, D. Paniccia, M. |
| description | We review recent advances in the development of silicon photonic integrated circuits for high-speed and high-capacity interconnect applications. We present detailed design, fabrication, and characterization of a silicon integrated chip based on wavelength division multiplexing. In such a chip, an array of eight high-speed silicon optical modulators is monolithically integrated with a silicon-based demultiplexer and a multiplexer. We demonstrate that each optical channel operates at 25 Gb/s. Our measurements suggest the integrated chip is capable of transmitting data at an aggregate rate of 200 Gb/s. This represents a key milestone on the way for fabricating terabit per second transceiver chips to meet the demand of future terascale computing. |
| doi_str_mv | 10.1109/JSTQE.2009.2033454 |
| format | Article |
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This represents a key milestone on the way for fabricating terabit per second transceiver chips to meet the demand of future terascale computing.</description><subject>Chip formation</subject><subject>Chips</subject><subject>High speed</subject><subject>High speed optical techniques</subject><subject>Integrated circuit interconnections</subject><subject>Integrated circuits</subject><subject>Integrated optics</subject><subject>Multiplexing</subject><subject>Optical arrays</subject><subject>Optical device fabrication</subject><subject>Optical interconnections</subject><subject>Optical modulation</subject><subject>photonic integrated circuit</subject><subject>Photonic integrated circuits</subject><subject>Photonics</subject><subject>Silicon</subject><subject>Silicon on insulator technology</subject><subject>silicon photonics</subject><subject>Wavelength division multiplexing</subject><subject>wavelength division multiplexing (WDM)</subject><issn>1077-260X</issn><issn>1558-4542</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqFUU1LJDEQbcQFP9Y_oJfGi6fWykd3J0cddR1xWUWX9RZiunqM9CRjkpb135txxIMXoah6FO89qnhFsUvgkBCQR5e3dzdnhxRA5sYYr_lasUnqWlQZ0vWMoW0r2sD9RrEV4xMACC5gs-j-6Rcc0M3SY3lqX2y03pW_xyHZxYD_rZuVJzpiV14_-uSdNeXUJZwFnfJuYoMZbYplltzawRrvqlxTF8dBJx_K6zx6H-Y_ix-9HiLufMzt4u_52d3korr682s6Ob6qDKc8VT1BlLQG3XSNaLCVxhgCRpCa63w_5bw3vew6zmXbaUYNYNcS6NgDPPQaGrZdHKx8F8E_jxiTmttocBi0Qz9GJdoaKAgJ3zJbzlpBiSCZuf-F-eTH4PIbShIiJZNsaUdXJBN8jAF7tQh2rsOrIqCWAan3gNQyIPURUBbtrUQWET8FNePQSMreAMcPjWw</recordid><startdate>201001</startdate><enddate>201001</enddate><creator>Ansheng Liu</creator><creator>Ling Liao</creator><creator>Chetrit, Y.</creator><creator>Basak, J.</creator><creator>Nguyen, H.</creator><creator>Rubin, D.</creator><creator>Paniccia, M.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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| identifier | ISSN: 1077-260X |
| ispartof | IEEE journal of selected topics in quantum electronics, 2010-01, Vol.16 (1), p.23-32 |
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| source | IEEE Xplore |
| subjects | Chip formation Chips High speed High speed optical techniques Integrated circuit interconnections Integrated circuits Integrated optics Multiplexing Optical arrays Optical device fabrication Optical interconnections Optical modulation photonic integrated circuit Photonic integrated circuits Photonics Silicon Silicon on insulator technology silicon photonics Wavelength division multiplexing wavelength division multiplexing (WDM) |
| title | Wavelength Division Multiplexing Based Photonic Integrated Circuits on Silicon-on-Insulator Platform |
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