The Limits of Post Oxidation Annealing in NO

We report on the benefits and the shortcomings of the NO annealing process following observations made on capacitors and transistors with various nitrogen densities at the SiO2/SiC interface. While NO annealing leads to a progressively lower interface state density and higher inversion mobility, con...

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Veröffentlicht in:Materials science forum 2010-01, Vol.645-648, p.693-696
Hauptverfasser: Williams, John R., Ahyi, Ayayi Claude, Feldman, Leonard C., Rozen, John, Zhu, Xing Guang
Format: Artikel
Sprache:eng
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Zusammenfassung:We report on the benefits and the shortcomings of the NO annealing process following observations made on capacitors and transistors with various nitrogen densities at the SiO2/SiC interface. While NO annealing leads to a progressively lower interface state density and higher inversion mobility, consistent with Coulomb-limited transport, MOSFET properties are still limited by the relatively poor interface quality. Moreover, NO induces a large amount of hole traps in the oxide. We establish that these properties are not related to the oxidation rate and we discuss them in terms of the nitrogen content.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.645-648.693