Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate

To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, a...

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Veröffentlicht in:	Journal of materials research 2010-02, Vol.25 (2), p.303-314
Hauptverfasser:	Zhang, QingKe, Zou, HeFei, Zhang, Zhe-Feng
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied and Technical Physics Biomaterials Inorganic Chemistry Materials Engineering Materials Science Microelectronics Nanotechnology Soldering
Online-Zugang:	Volltext
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