Frits in thick film superconductors: a special approach for improving superconducting and adhesion properties

Frits in thick film superconductors: a special approach for improving superconducting and adhesion properties

Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion a...

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Veröffentlicht in:Microelectronics international 1998-12, Vol.15 (3), p.22-25
Hauptverfasser: Harsányi, Gábor, Liu, Yanqing, Kinzy Jones, W
Format: Artikel
Sprache:eng
Schlagworte:
Adhesion
Alumina
Grain size
High temperature
High temperature superconductors
Investigations
Mechanical engineering
Microelectronics
Particle size
Studies
Superconductivity
Superconductors
Systems analysis
Thick film
Thin films
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Zusammenfassung:Specially formulated frit materials have been applied in thick film superconductors similar to the standard thick film materials in order to achieve processing parameters closely compatible with conventional thick film technology and alumina substrates. The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising.
ISSN:1356-5362
1758-812X
DOI:10.1108/13565369810233113