Creep deformation characteristics of tin and tin-based electronic solder alloys
Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures...
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| Veröffentlicht in: | Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2005, Vol.36 (1), p.99-105 |
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| container_title | Metallurgical and materials transactions. A, Physical metallurgy and materials science |
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| creator | MATHEW, M. D YANG, H MOVVA, S MURTY, K. L |
| description | Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n = 7.6, 5.0, and 5.0) and activation energy (Q^sub c^ = 60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q^sub c^ values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays. [PUBLICATION ABSTRACT] |
| doi_str_mv | 10.1007/s11661-005-0142-z |
| format | Article |
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D ; YANG, H ; MOVVA, S ; MURTY, K. L</creator><creatorcontrib>MATHEW, M. D ; YANG, H ; MOVVA, S ; MURTY, K. L</creatorcontrib><description>Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n = 7.6, 5.0, and 5.0) and activation energy (Q^sub c^ = 60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q^sub c^ values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays. 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D</creatorcontrib><creatorcontrib>YANG, H</creatorcontrib><creatorcontrib>MOVVA, S</creatorcontrib><creatorcontrib>MURTY, K. L</creatorcontrib><title>Creep deformation characteristics of tin and tin-based electronic solder alloys</title><title>Metallurgical and materials transactions. A, Physical metallurgy and materials science</title><description>Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n = 7.6, 5.0, and 5.0) and activation energy (Q^sub c^ = 60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q^sub c^ values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays. [PUBLICATION ABSTRACT]</description><subject>Alloys</subject><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Creep</subject><subject>Creep rupture strength</subject><subject>Deformation</subject><subject>Exact sciences and technology</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metallurgy</subject><subject>Metals. 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A, Physical metallurgy and materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>MATHEW, M. D</au><au>YANG, H</au><au>MOVVA, S</au><au>MURTY, K. L</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Creep deformation characteristics of tin and tin-based electronic solder alloys</atitle><jtitle>Metallurgical and materials transactions. A, Physical metallurgy and materials science</jtitle><date>2005</date><risdate>2005</risdate><volume>36</volume><issue>1</issue><spage>99</spage><epage>105</epage><pages>99-105</pages><issn>1073-5623</issn><eissn>1543-1940</eissn><coden>MMTAEB</coden><abstract>Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n = 7.6, 5.0, and 5.0) and activation energy (Q^sub c^ = 60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q^sub c^ values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays. [PUBLICATION ABSTRACT]</abstract><cop>New York, NY</cop><pub>Springer</pub><doi>10.1007/s11661-005-0142-z</doi><tpages>7</tpages></addata></record> |
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| subjects | Alloys Applied sciences Brazing. Soldering Creep Creep rupture strength Deformation Exact sciences and technology Joining, thermal cutting: metallurgical aspects Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metallurgy Metals. Metallurgy Strain rate Tin |
| title | Creep deformation characteristics of tin and tin-based electronic solder alloys |
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