Print-and-Peel Fabrication of Microelectrodes

We describe a facile and expedient approach for the fabrication of arrays of microelectrodes on smooth substrates. A sequence of print-and-peel procedures allowed for the microfabrication of capacitance microsensors using office equipment and relatively simple wet chemistry. Microfluidic assemblies with reversibly adhered elastomer components allowed for the transfer of patterns of metallic silver, deposited via Tollens’ reaction, onto the substrate surfaces. Electroplating of the silver patterns produced an array of micrometer-thick copper electrodes. Capacitance sensors were assembled by placing nonlithographically fabricated flow chambers over the microelectrode arrays. Triangular-waveform current-voltage (I/V) measurements showed a linear correlation between the capacitance of the print-and-peel fabricated devices and the dielectric constant of the samples injected into their flow chambers.