Diffusion-induced water movement within resin-dentin bonds during bonding

It is thought that water‐filled channels and nanovoids in resin–dentin bonds represent potential sites for degradation of bonds or hydrolysis of collagen or both. How water gains access to bonded interfaces is not clear. This study evaluated the diffusion‐induced water uptake through resin–dentin in...

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Veröffentlicht in:Journal of biomedical materials research. Part B, Applied biomaterials Applied biomaterials, 2006-11, Vol.79B (2), p.453-458
Hauptverfasser: Hashimoto, Masanori, Tay, Franklin R., Sano, Hidehiko, Kaga, Masayuki, Pashley, David H.
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Sprache:eng
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Zusammenfassung:It is thought that water‐filled channels and nanovoids in resin–dentin bonds represent potential sites for degradation of bonds or hydrolysis of collagen or both. How water gains access to bonded interfaces is not clear. This study evaluated the diffusion‐induced water uptake through resin–dentin interfaces during bonding. Two light‐cured total‐etch adhesive systems (Excite and One‐Step Plus) and a chemical‐cured adhesive (Amalgambond Plus) were used in this study. Dentin disks were placed in a split‐chamber device, and the fluid movement across dentin was measured, with and without a physiological pressure, during bonding procedures and 24 h after bonding. For light‐cured adhesives in the experimental groups, a 6 min interval of dark storage was conducted prior to light‐curing, to evaluate the diffusion of water through the uncured resin monomers, and to test the effect of prolonged infiltration time of adhesives on water permeability of bonds. Prolonged adhesive infiltration reduced the water permeability of resin–dentin bonds for light‐cured adhesives. Water gradients produced by bonding systems contribute to water movement across the dentin–adhesive interfaces during bonding procedures. Differences in chemical formulations for adhesive systems may lead to differences in the extent of diffusion‐induced water movement and the amount of water within the resin–dentin bonds. © 2006 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 2006
ISSN:1552-4973
1552-4981
DOI:10.1002/jbm.b.30562