A novel metal-protected plasma treatment for the robust bonding of polydimethylsiloxane
We describe a method for the irreversible bonding of PDMS-based microfluidic components by exploiting the first reported "shelfable" plasma treatment of PDMS. Simultaneous plasma activation and protection of PDMS surfaces are achieved via RF magnetron sputtering of thin aluminium films in...
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Veröffentlicht in: | Lab on a chip 2007-01, Vol.7 (12), p.1813-1818 |
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Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | We describe a method for the irreversible bonding of PDMS-based microfluidic components by exploiting the first reported "shelfable" plasma treatment of PDMS. Simultaneous plasma activation and protection of PDMS surfaces are achieved via RF magnetron sputtering of thin aluminium films in the presence of an argon plasma. In this process, Ar plasma exposure generates a hydrophilic, silanol-enriched polymer surface amenable to irreversible bonding to glass, PDMS or silicon substrates, while the aluminium film functions as a capping layer to preserve the surface functionality over several weeks of storage in ambient conditions. Prior to bonding, this protective aluminium layer is removed by immersion in an aqueous etchant, exposing the adhesive surface. Employing this technology, PDMS-glass and PDMS-PDMS microfluidic devices were fabricated and the adhesive strength was quantified by tensile and leakage testing. Bonding success rates in excess of 80% were demonstrated for both PDMS-glass and PDMS-PDMS assemblies sealed 24 h and 7 days following initial polymer surface activation. PDMS-glass microdevices performed optimally, displaying maximum adhesive strengths on the order of 5 MPa and burst flow rates of approximately 1 mL min(-1) (channel dimensions: l = 25 mm; w = 300 microm; h = 20 microm). These data demonstrate a significant improvement in performance over previously reported bonding technologies, resulting in the production of more robust, longer-lasting microfluidic systems that can withstand higher pressures and flow rates. |
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ISSN: | 1473-0197 1473-0189 |
DOI: | 10.1039/b709761a |