A mechanism on why slower polymerization of a dental composite produces lower contraction stress
It has been well documented that the rate of polymerization of a dental composite often affects its polymerization contraction stress. In most cases, a slower cure produces a lower stress. To investigate the mechanism behind this, we prepared an unfilled dimethacrylate resin sample and photocured it...
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Veröffentlicht in: | Journal of biomedical materials research. Part B, Applied biomaterials Applied biomaterials, 2006-07, Vol.78B (1), p.63-69 |
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Sprache: | eng |
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Zusammenfassung: | It has been well documented that the rate of polymerization of a dental composite often affects its polymerization contraction stress. In most cases, a slower cure produces a lower stress. To investigate the mechanism behind this, we prepared an unfilled dimethacrylate resin sample and photocured it using two light irradiances, both with the same total irradiation energy. We measured the polymerization‐induced shrinkage from the unbonded surface of a class I restoration, contraction stress, extent of polymerization, and flexural modulus. The resin specimens cured under the two irradiances achieved the same extent of polymerization and developed an identical amount of shrinkage from the unbonded surface. But those cured under the lower irradiance possessed a lower contraction stress and a lower flexural modulus than those cured under the higher irradiance. We demonstrated that the stress level did not respond to the extent of viscous flow of the curing resin because the slower polymerization did not produce more shrinkage from the unbonded surface. Instead, the lower stress is likely due to a lower modulus of the cured resin. To explain why the cured resin with an identical extent of polymerization can have different moduli, we proposed that slower polymerization produces a higher level of structural inhomogeneity, which reduces the rigidity of the cured resin. © 2006 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 2006 |
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ISSN: | 1552-4973 1552-4981 |
DOI: | 10.1002/jbm.b.30453 |