Hyaluronic Acid-Poly-D-Lysine-Based Three-Dimensional Hydrogel for Traumatic Brain Injury
Brain tissue engineering in the postinjury brain represents a promising option for cellular replacement and rescue, providing a cell scaffold for either transplanted or resident cells. In this article, a hyaluronic acid (HA)-poly-D-lysine (PDL) copolymer hydrogel with an open porous structure and vi...
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Veröffentlicht in: | Tissue engineering 2005-03, Vol.11 (3-4), p.513-525 |
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Sprache: | eng |
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Zusammenfassung: | Brain tissue engineering in the postinjury brain represents a promising option for cellular replacement
and rescue, providing a cell scaffold for either transplanted or resident cells. In this article, a
hyaluronic acid (HA)-poly-D-lysine (PDL) copolymer hydrogel with an open porous structure and
viscoelastic properties similar to neural tissue has been developed for brain tissue engineering. The
chemicophysical properties of the hydrogel with HA:PDL ratios of 10:1, 5:1, and 4:1 were investigated
by scanning electron microscopy (SEM) and X-ray photoelectron spectrometry. Neural cells
cultured in the hydrogel were studied by phase-contrast microscope and SEM. The incorporation
of PDL peptides into the HA-PDL hydrogel allowed for the modulation of neuronal cell adhesion
and neural network formation. Macrophages and multinucleated foreign body giant cells found at
the site of implantation of the hydrogel in the rat brain within the first weeks postimplantation decreased
in numbers after 6 weeks, consistent with the host response to inert implants in numerous
tissues. Of importance was the infiltration of the hydrogel by glial fibrillary acidic protein-positive
cells-reactive astrocytes-by immunohistochemistry and the contiguity between the hydrogel and
the surrounding tissue demonstrated by SEM. These findings indicated the compatibility of this hydrogel
with brain tissue. Collectively, the results demonstrate the promise of an HA-PDL hydrogel
as a scaffold material for the repair of defects in the brain. |
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ISSN: | 1076-3279 1557-8690 |
DOI: | 10.1089/ten.2005.11.513 |