Interfacial characteristics of film insert molded polycarbonate film/polycarbonate-acrylonitrile-butadiene-styrene substrate, part 1: Influence of substrate molecular weight and film thickness

Interfacial characteristics of film insert molded polycarbonate film/polycarbonate-acrylonitrile-butadiene-styrene substrate, part 1: Influence of substrate molecular weight and film thickness

Adhesion properties between a polycarbonate (PC)/acrylonitrile‐butadiene‐styrene blend substrate and PC films of various thicknesses, bonded through film insert molding, were investigated. The use of various molecular weights of PC and incorporation of PC‐oligomer in the blend substrate has been fou...

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Veröffentlicht in:Polymer engineering and science 2006-12, Vol.46 (12), p.1674-1683
Hauptverfasser: Leong, Y.W., Ishiaku, U.S., Kotaki, M., Hamada, H., Yamaguchi, S.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Exact sciences and technology
Injection molding
Injection moulding
Machinery and processing
Materials science
Molecular weight
Moulding
Plastics
Polycarbonate resins
Polymer industry, paints, wood
Polymers
Properties
Substrates
Technology of polymers
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Zusammenfassung:Adhesion properties between a polycarbonate (PC)/acrylonitrile‐butadiene‐styrene blend substrate and PC films of various thicknesses, bonded through film insert molding, were investigated. The use of various molecular weights of PC and incorporation of PC‐oligomer in the blend substrate has been found to severely affect the adhesion strength and alter the delamination characteristics at the film–substrate interface. Thicker films were able to increase film–substrate adhesion, apart from providing added impact resistance to a brittle substrate. Polym. Eng. Sci. 46:1674–1683, 2006. © 2006 Society of Plastics Engineers
ISSN:0032-3888
1548-2634
DOI:10.1002/pen.20644