Micro-contact CSP

Many of today's advanced packages use solder ball contact arrays to make package-to-board or package-to-package level 2 electrical connections. Solder ball contacts have served the industry well and will continue to be used for a variety of applications. However, the contact density is approaching practical limitations for ball grid array (BGA) interconnection at fine pitches using SMT assembly approaches. The micro-contact chip-scale package (CSP) has been developed to address these needs, targeting key technology drivers such as reduced package pitch for high-density area-array CSP products, increased capability for high-density package-on-package (PoP) stacking at finer pitches and higher I/O, high reliability for mobile electronic applications, and lower overall package height and volume for mobile and other highfunctional-density electronics. The main feature of the micro-contact substrate is the Ni/Au-plated copper bump, which allows for SMT assembly of the CSP to the board.