From the Tradeshow Floor: IMAPS Device Packaging

Suzanne Redding, global marketing strategy manager; and Eugene Douglass, process development engineer, of Rohm & Haas advanced packaging division, noted that most customers are looking to implement fine-pitch designs successfully, and require advanced materials for this transition. Rao Tummala, founding director, Georgia Tech's Packaging Research Center, and Advanced Packaging Advisory Board member, spoke about moving past Moore's Law into the second law, the "System Integration Law," wherein IC, package, and board integrate, forming a system-on-package (SoP).